Staff/Principal Engineer, Advanced Packaging Integration (APTD CEM)

About the role

Micron's Advanced Packaging Technology Development (APTD) team develops package development for high-performance memory products and transfers them to manufacturing. It is looking for an Advanced Packaging Integration Engineer to join the APTD team and enable deployment of advanced packaging technologies that meet performance, cost, manufacturability, quality, reliability and schedule requirements. The role also involves identifying and proposing yield-related breakthroughs and coordinating the development and launch of new technologies with peers and partners.

Key responsibilities

• Develop and enable advanced package technology for post-fab wafer finish and assembly processes, improving quality, yield, productivity and reducing costs
• Integrate semiconductors while partnering with process and product engineering teams
• Improve yields through silicon package integration, including layout/design and process margin improvements, and analyse data to support layout, design or integration flow changes
• Work with Probe, Yield Analysis, Test and Product Engineering teams
• Ensure process, measurement, inspection and testing coverage, establish correlations between defense mechanisms and run continuous data analysis to set advanced controls
• Build technology development strategies with internal and external stakeholders and ensure a smooth transition from NPD, qualification and small-volume to high-volume production
• Provide Process of Record (POR) and Model of Record (MOR) documentation for transfer to high-volume manufacturing
• Use AI-assisted tools responsibly and share AI-enabled improvements within your scope

Required profile

• PhD with at least 2 years' master's degree and 5 years' experience, or bachelor's degree with at least 7 years' experience in electrical engineering, materials science, chemical engineering, physics or a related field
• Semiconductor process integration experience, preferably developing advanced package technology for post-fab wafer finish and assembly
• Strong analytical and problem-solving skills, and strong communication, leadership and stakeholder management skills
• Ability to work independently and cross-functionally in a fast-paced environment
• Baseline digital fluency and role-appropriate AI literacy

Required skills

• Python, R and SQL for statistical analysis, process modeling and data analytics
• Visual Basic for automation and tool integration
• Familiarity with E3, FDC (Fault Detection and Classification) and RMS (Recipe Management System)
• Data analytics for SPC, DOE, defect analysis and dashboarding