Staff/Principal Engineer, Advanced Packaging Wafer Level Technology

About the role

Micron's Advanced Packaging Technology Development (APTD) delivers package development for high-performance memory products and transfers them to manufacturing. The role covers post-fab wafer finishing processes in semiconductor manufacturing, working with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows.

Key responsibilities

• Develop and enable deployment of post-fab wafer finishing processes meeting performance, cost, manufacturability, quality, reliability and schedule requirements.
• Establish and improve wafer-level process conditions and technologies such as wafer thinning and backside metal interconnect, and upgrade process capabilities to reduce production costs.
• Manage process projects to deliver technology node requirements and scaling for the next node.
• Evaluate and promote new equipment and materials, and set process parameters for semiconductor equipment.
• Ensure process defense coverage through process, measurement, inspection and testing, and use data analysis to establish advanced controls.
• Work with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering and Global Quality to integrate manufacturing processes.
• Support the transition from new product development and qualification to high-volume production, and provide Process of Record and Model of Record documentation for product transfer to fabrication facilities.
• Use AI-assisted tools to improve efficiency, quality and effectiveness, and share AI-enabled improvements.

Required profile

• PhD with at least 2 years, or Master's degree with at least 5 years, or Bachelor's degree with at least 7 years of experience in electrical engineering, materials science, chemical engineering, physics or a related field.
• Semiconductor process development experience, preferably in wafer bonding, plating, warpage control and packaging.
• Strong analytical and problem-solving abilities, and strong communication, leadership and stakeholder management skills.
• Ability to work independently and cross-functionally in a fast-paced environment.
• Baseline digital fluency and role-appropriate AI literacy.

Required skills

• Python, R and SQL for statistical analysis, process modeling and data analytics.
• Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification) and RMS (Recipe Management System).
• Data analytics for SPC, DOE, defect analysis and dashboarding.