Technology Development Engineer - Hybrid Bonding & Advanced Packaging (Internship)

About the role

Applied Materials, a global leader in materials science and engineering solutions for semiconductors and advanced displays, is offering a full-time internship in Singapore focused on hybrid bonding and advanced packaging. The project develops and integrates advanced packaging building blocks such as redistribution layers (RDL), damascene copper structures, wafer-level interconnects and hybrid bonding processes. The intern supports the Process Integration team in developing and characterizing test vehicles for chip-to-wafer and wafer-to-wafer hybrid bonding applications.

Key responsibilities

• Process flow development and experimental design for hybrid bonding test vehicles
• Data analysis and defect characterization
• Correlating process parameters with electrical and physical performance metrics
• Gaining hands-on exposure to semiconductor fabrication processes, advanced packaging integration challenges, statistical data analysis and engineering problem-solving

By the end of the internship, the candidate is expected to have a solid understanding of advanced packaging technology, process integration principles and engineering best practices, while contributing to ongoing R&D projects for next-generation semiconductor packaging.

What we offer

• A supportive work culture that encourages learning, development and career growth
• Programs and support for employee health, wellbeing and personal and professional growth

The position is full time, with no travel and no relocation eligibility.