Technology Development Process Engineer - Hybrid Bonding & Advanced Packaging

About the role

Applied Materials is looking for a Technology Development Process Engineer in Singapore to lead the development and integration of advanced packaging technologies, with a focus on Hybrid Bonding solutions for Logic, Memory and 3D heterogeneous integration. The role covers process development, technology innovation and customer-driven solutions from concept through qualification.

Key responsibilities

• Develop and optimize end-to-end Hybrid Bonding processes, including wafer/die surface preparation, wet and dry cleaning, plasma activation, dielectric-to-dielectric bonding, Cu-Cu direct bonding and post-bond annealing, to meet bonding yield, alignment, electrical performance and reliability targets.
• Design and run process characterization and DOE studies to define process windows and improve bond strength, void density, overlay accuracy, Cu oxidation control and interface quality.
• Investigate integration challenges such as CMP surface topography, surface chemistry, contamination control, pattern density, thermal budget, wafer/die warpage and bonding defects using data-driven root cause analysis.
• Work with equipment, materials, metrology and integration teams on scalable die-to-wafer Hybrid Bonding solutions for HBM, Logic and 3D heterogeneous integration.
• Define characterization methods using optical inspection, IR imaging, SEM, AFM, XPS, contact angle measurement, electrical testing and reliability evaluation.
• Support development of HBM, Logic, TSV, RDL and die-to-wafer bonding technologies.
• Engage customers, research institutes and partners on joint technology development, and produce technical reports, patents, publications and roadmaps.

Required profile

• Bachelor's, Master's or PhD in Engineering, Materials Science, Physics or a related discipline.
• Minimum 5 years of semiconductor experience in technology development, process integration or advanced packaging.
• Hands-on experience in advanced packaging, hybrid bonding, CMP, plasma processing, wet cleaning, TSV integration or process integration.

Required skills

• Preferred: strong understanding of Hybrid Bonding mechanisms and package integration flows.
• Preferred: DOE, JMP/Minitab and statistical process analysis.
• Preferred: knowledge of reliability, failure analysis and advanced metrology.

The work location is Science Park II, moving to the Tampines office from April 2027. The position is full-time, regular and relocation is not eligible.