Advanced Packaging Equipment Engineer (APTD CEM)

About the role

Micron is hiring an Advanced Packaging Equipment Engineer (APTD CEM) in its Fab 10A facility. The role develops and optimises advanced packaging equipment for technology enablement, including wafer-level packaging and stacking, and works with internal and external partners to align technology development with business objectives.

Key responsibilities

• Develop and optimise advanced packaging equipment, improving capability, reducing costs and increasing productivity
• Establish and improve equipment management projects to meet technology needs
• Evaluate new equipment and materials and set hardware roadmaps for 5+ years of post-probe wafer and die processing
• Ensure defence coverage through process, measurement, inspection and testing, and analyse data to set advanced controls
• Work with teams such as Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering and Global Quality to integrate manufacturing processes
• Support the transition from new product development and qualification to high-volume production

Required profile

• Bachelor's or advanced degree in Engineering or Science
• Strong analytical, logical and critical thinking skills
• Effective communicator who collaborates across all levels
• Growth mindset, leadership and a track record of impact are highly desirable
• Knowledge of the semiconductor industry and Micron is preferred

Required skills

• Preferred: Python, R and SQL for statistical analysis, process modelling and data analytics
• Preferred: Visual Basic for automation and tool integration
• Internship or experience in the semiconductor industry is a plus