Diffusion Process Engineer - 300mm Advance Packaging
globalfoundries · Singapore
Job description
About the role
GlobalFoundries Singapore is looking for an experienced Diffusion Process Engineer to join its starting 300mm Advance Packaging Center. The role reports directly to a functional area module manager in Giga Fab in Singapore and focuses on developing and optimizing unit processes for advance packaging, including bonding and debonding, plasma/UV/cleaning, die re-constitution, annealing and TSV.
Key responsibilities
- Develop and optimize unit processes for advance packaging (bond & debond, pre-bond plasma/UV/cleaning, die re-constitution, annealing and TSV) on multi-stack bonded wafers and die-to-wafer processes.
- Troubleshoot process and tool issues, and assist with tooling start-up and installation of processes into manufacturing.
- Design, execute and analyze experiments to develop advanced packaging etch processes meeting performance, yield, reliability, stability and cost targets.
- Startup and qualify new processes and new equipment within schedule, working with the Equipment Engineer on acceptance and tool matching.
- Improve process robustness for high volume manufacturing using statistical tools, DOE, data-driven decisions, lean manufacturing and Six Sigma.
- Work with the equipment team to improve equipment productivity indices and resolve complex technical and yield issues.
- Support the integration team and quality organization to meet qualification and reliability requirements, and sustain and improve process and SPC.
- Coach other engineers on advance packaging etch processes, facilitate CIP programs and plan strategies to optimize process capability.
- Carry out all work safely and in line with environmental, health, safety and security requirements.
Required profile
- BS, Master's or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or another relevant physical science discipline.
- Relevant manufacturing and development experience.
- Experience with bonder tools (TEL W2W/BESI D2W), die re-constitution and annealing tools (TEL Alpha 303, Mattson-Helios).
- Excellent verbal and written communication skills and strong interpersonal skills across cultures.
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Published 9 hours ago
Expires 1 month from now
6 views · 0 interested
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globalfoundries
Singapore