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Diffusion Process Engineer - 300mm Advance Packaging

globalfoundries · Singapore

New
Senior 🇬🇧 English
DOE Six Sigma SPC Lean manufacturing Advanced packaging etch processes

Job description

About the role

GlobalFoundries Singapore is looking for an experienced Diffusion Process Engineer to join its starting 300mm Advance Packaging Center. The role reports directly to a functional area module manager in Giga Fab in Singapore and focuses on developing and optimizing unit processes for advance packaging, including bonding and debonding, plasma/UV/cleaning, die re-constitution, annealing and TSV.

Key responsibilities

  • Develop and optimize unit processes for advance packaging (bond & debond, pre-bond plasma/UV/cleaning, die re-constitution, annealing and TSV) on multi-stack bonded wafers and die-to-wafer processes.
  • Troubleshoot process and tool issues, and assist with tooling start-up and installation of processes into manufacturing.
  • Design, execute and analyze experiments to develop advanced packaging etch processes meeting performance, yield, reliability, stability and cost targets.
  • Startup and qualify new processes and new equipment within schedule, working with the Equipment Engineer on acceptance and tool matching.
  • Improve process robustness for high volume manufacturing using statistical tools, DOE, data-driven decisions, lean manufacturing and Six Sigma.
  • Work with the equipment team to improve equipment productivity indices and resolve complex technical and yield issues.
  • Support the integration team and quality organization to meet qualification and reliability requirements, and sustain and improve process and SPC.
  • Coach other engineers on advance packaging etch processes, facilitate CIP programs and plan strategies to optimize process capability.
  • Carry out all work safely and in line with environmental, health, safety and security requirements.

Required profile

  • BS, Master's or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or another relevant physical science discipline.
  • Relevant manufacturing and development experience.
  • Experience with bonder tools (TEL W2W/BESI D2W), die re-constitution and annealing tools (TEL Alpha 303, Mattson-Helios).
  • Excellent verbal and written communication skills and strong interpersonal skills across cultures.

Questions fréquentes

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Source : ats:workday

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Published 9 hours ago

Expires 1 month from now

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globalfoundries

Singapore