Director, Process Support Engineer (Advanced Packaging)

About the role

Applied Materials is looking for a Director, Process Support Engineer (Advanced Packaging) based in Singapore. You will act as a key technical leader, partnering with customers and internal R&D teams to drive process optimization, technology adoption and next-generation advanced packaging solutions. The work location is the Woodlands office.

Key responsibilities

• Lead the resolution of complex customer process challenges using systematic troubleshooting, root cause analysis, statistical methods and Design of Experiments (DOE).
• Set up and run cross-functional issue management mechanisms across Business Units, Engineering, Service, Product Development and Customer Support.
• Provide technical leadership for customer demonstrations, proof-of-concept activities and technology evaluations.
• Work with strategic customers to develop and optimize advanced packaging process flows.
• Act as a technical advisor on technologies such as wafer-level packaging, fan-out, RDL, hybrid bonding, bumping, TSV and heterogeneous integration.
• Influence product roadmaps and drive process and hardware enhancements with product development and engineering teams.
• Lead technology transfer, customer enablement, qualification planning and production ramp support.
• Build partnerships with semiconductor manufacturers, OSATs and research institutes, and run joint development programs and beta-site evaluations.
• Represent Applied Materials at executive-level customer engagements and share customer insights globally.

Required profile

• Preferred: PhD, Master's or Bachelor's degree in Materials Science, Chemical, Electrical, Physics or Mechanical Engineering or a related field.
• 15+ years of semiconductor industry experience in advanced packaging process development, process integration, customer engineering or technology pathfinding.
• Experience working directly with foundries, OSATs, IDMs or semiconductor equipment suppliers.
• Proven ability to influence customers and stakeholders at technical and executive levels.
• Strong leadership, communication and cross-functional collaboration skills in a global environment.

Required skills

• Knowledge of packaging technologies such as Fan-Out, CoWoS, 2.5D/3D integration, RDL, TSV, hybrid bonding, electroplating, CMP and heterogeneous integration.
• Expertise in DOE, statistical process control, failure analysis, root cause investigation and yield improvement.
• Experience leading strategic customer engagements, joint development programs or technology commercialization initiatives is highly desirable.

The position is full-time, with travel of about 10% of the time and relocation eligibility.