Distinguished Member of Technical Staff - CMP Process Development (NAND)

About the role

Micron is hiring a Distinguished Member of Technical Staff (DMTS) for its Fab 10N/X site, focused on CMP process development for NAND technology. The DMTS acts as the CMP technical authority, defines long-term technology and equipment strategies, leads next-generation CMP innovation and complex yield and defectivity challenges, and mentors senior technical leaders.

Key responsibilities

• Serve as CMP technical authority for NAND technology development, defining long-term technology and equipment strategies
• Architect and drive next-generation CMP process innovation, including FOAK developments, recipe architecture and integration alignment
• Resolve complex yield, defectivity and integration challenges through deep CMP process, materials and layout expertise
• Define and execute CMP hardware and supplier roadmaps, and lead supplier technical reviews and head-to-head evaluations
• Drive cross-functional execution across Technology Development, Process Integration, Manufacturing and Equipment teams
• Identify scaling risks early and drive proactive mitigation strategies
• Mentor senior engineers and represent Micron CMP in cross-site and external technical forums
• Prepare presentations, white papers and patent filings, and initiate collaborations with universities and research institutes

Required profile

• PhD with at least 15 years, or Master's degree with at least 17 years, of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field
• Experience in CMP process development within an R&D environment (NAND, DRAM or Logic), with proven transfer to manufacturing
• Publications, patents and a strong record of technical contributions
• Demonstrated technical leadership in complex problem solving and ability to lead high-impact programs

Required skills

• Deep expertise in CMP fundamentals: pad-slush-wafer interactions, mechanistic slurry chemistry and pattern density/layout effects
• Broad knowledge of metal, dielectric, barrier/hardmask and poly-Si/Si CMP processes
• Hands-on experience with advanced 300 mm CMP OEM platforms
• Statistical process control (SPC), data analysis and process qualification
• Technical communication at executive level