FE cPIE Principal Engineer / Senior Manager - HBM

About the role

Micron Technology, Inc. is hiring a Front End Central Product Integration (FE cPIE) Principal Engineer / Senior Manager for its HBM (High Bandwidth Memory) PI team. You will lead the global Micron network to drive leading-edge HBM product yield, quality improvement and new product introduction, working with Japan, Taiwan, Singapore and US teams to mature products within schedule while keeping the highest quality standards.

Key responsibilities

• Strategic leadership: work with the fab to drive best-in-class yield ramping, and with business partners to define process integration tools, systems, methodologies, capabilities and roadmaps that support Micron's business plan
• Tactical leadership: run metrics reviews of critical deliverables, remove barriers and escalate performance issues, and hold regular one-on-ones with team members
• Performance management: set clear goals, job profiles and expectations, partner on aggressive but achievable targets, and drive accountability through communication, feedback and metrics
• Communication: share progress on strategic objectives, operations goals and priority projects, and build external relationships to keep up with industry standards
• Training and career development: maintain the group's training roadmap, develop successors and mentor team members
• Use AI-assisted tools responsibly to improve efficiency and quality, and contribute to continuous improvement

Required profile

• Bachelor's, Master's or PhD in Electrical Engineering, Materials Engineering, Materials Science, Physics or Chemical Engineering
• 7+ years of experience in a process-related role in the semiconductor industry
• Strong ownership, grit and determination, and proven ability to solve structure and device issues and find root causes
• Willingness to travel to Micron sites, 20-50% of the time, for face-to-face collaboration

Required skills

• Knowledge of semiconductor fabrication process flows and how changes affect yield, device performance and reliability
• Understanding of DRAM and NAND operation and structure, and ability to interpret parametric, probe and qual data from front-end and back-end assembly
• Data-driven decision making, model-based problem solving and presentation skills
• Digital fluency and role-appropriate AI literacy
• Cross-cultural collaboration in multi-national environments