Front End Central Product Integration (FE CPIE) MTS

About the role

Micron is hiring a Front End Central Product Integration (FE CPIE) MTS (FE) for its Fab 10A site. The role leads process integration (PI) structural uniformity and cross-loop integration for critical modules such as the capacitance loop, driving physics- and process-based solutions with process owners, PI subject-matter experts and suppliers to meet BIC yield and quality targets.

Key responsibilities

• Lead PI structural uniformity and cross-loop integration, resolving yield, quality and reliability gaps
• Develop model-based root cause analysis frameworks (transport, reaction kinetics, pattern density, geometry-dependent effects)
• Define and strengthen inline monitoring and defence lines (CD, film loss, mass delta, defectivity, edge/periphery metrics)
• Drive node-over-node shift-left integration, including early uniformity, bevel and backside best-known-methods (BKMs)
• Lead global projects, standardize network BKMs and scale proven solutions across sites
• Identify efficiency gaps and lead business process creation, optimization and re-engineering
• Integrate AI-assisted tools into daily work and share AI-enabled improvements

Required profile

• Bachelor's, Master's or PhD in EE, Materials Engineering, Materials Science, Physics or Chemistry (optional if more than 10 years of process-related semiconductor experience)
• More than 7 years of relevant industry experience
• Willingness to travel to Micron sites for face-to-face collaboration

Required skills

• Knowledge of semiconductor fabrication process flows and how changes affect yield, device performance and reliability
• Understanding of DRAM and NAND operation and structure, and ability to interpret parametric, probe and qual data
• Model-based problem solving, data-driven decision making and troubleshooting of structure and device issues
• Digital fluency and role-appropriate AI literacy