HBM Product & System Engineering - Reliability Test Coding

About the role

Micron is looking for an engineer in its High Bandwidth Memory (HBM) Product & System Engineering team to write and debug reliability test programs for HBM devices and packages. The role covers intrinsic and extrinsic reliability testing, including extended wafer-level burn-in, pWLRx and ELFR, for DRAM and interface dies and stacked products, and aims to meet quality, cost and cycle-time targets.

Key responsibilities

• Write and debug test programs for HBM device and package qualification, working with other teams to ensure full test coverage.
• Investigate and resolve root causes of reliability test program issues.
• Promote innovation and change, such as new reliability features and infrastructure optimization.
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams.
• Use in-house statistical tools to analyze engineering data for validation and risk assessment.
• Define interface hardware specifications, validate and debug new interface boards.
• Make final decisions on risk analysis and project prioritization.
• Manage projects efficiently and identify process improvements for cost and quality gains.

Required profile

• Bachelor's or Master's degree in Electrical & Electronics Engineering, Computer Science or a related field, or equivalent experience.
• Strong problem-solving ability focused on root cause analysis.
• Team player able to contribute to shared goals.

Required skills

• Programming in Python and C++ (a must).
• Familiarity with CMOS technology, DRAM architecture and basic device physics.
• Exposure to data analysis, statistics and scripting tools such as Python or JMP.
• Familiarity with testing and verification approaches.