HBM Reliability Engineer

About the role

Micron is looking for an HBM Reliability Engineer at Fab 10A. The role covers reliability test flow development, qualification execution, DPM reduction, root cause analysis of device issues, and support of process conversions and risk management for HBM products.

Key responsibilities

• Define and develop reliability stress, test flows and test plans covering all product reliability aspects.
• Work with the Global Quality team to define the qualification plan, manage qualification execution progress and drive resolution of gating issues.
• Reduce extrinsic (time 0 and field) and intrinsic DPM through optimized manufacturing test flows and test strategy, meeting quality, cost and cycle time KPIs.
• Debug and resolve qualification and RMA device issues using electric failure analysis (EFA) and physical failure analysis (PFA).
• Advise fab teams on process conversions that reduce cost and increase yield, and communicate with Product Managers to manage conversion risks.
• Promote innovation and technical advantages, manage project priorities and deliver projects on time.
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams.

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.
• Coursework or internship in semiconductor devices, circuit design or product validation is a plus.
• Strong problem-solving approach focused on root cause identification.
• Attention to detail, teamwork, flexibility and clear written and spoken English.

Required skills

• Familiarity with CMOS technology, DRAM architecture and basic device physics.
• Data analysis, statistics and scripting tools such as Python or JMP.