Metrology Engineer - SEMVision Defect Analysis

About the role

Applied Materials is looking for a Metrology Engineer specializing in SEMVision defect analysis to strengthen its defect characterization and yield engineering capability. The role supports defect learning cycles, yield enhancement initiatives and high-volume manufacturing operations. It is based in Singapore and involves reviewing defects, classifying them, performing root-cause analysis and driving follow-up Failure Analysis.

Key responsibilities

• Review defects detected by brightfield/darkfield inspection tools and perform high-resolution imaging of defect morphology.
• Classify defects manually and via Automatic Defect Classification (ADC), building, tuning and maintaining ADC recipes and defect libraries.
• Perform EDX elemental analysis on SEMVision to identify defect composition and contamination sources.
• Analyze defect Pareto, wafer maps, spatial signatures and trends to separate systematic from random defects.
• Trace defects back to the source process step, tool or chamber using inline data, commonality analysis and partition/short-loop experiments.
• Define and request follow-up Failure Analysis (FIB, TEM, STEM/EDS, Auger, SIMS) and interpret results.
• Correlate defect data with inline metrology, electrical tests (WAT/CP) and yield data to quantify kill ratio and yield impact.
• Work with process integration and module teams (litho, etch, deposition, CMP, clean) to implement corrective actions.
• Optimize SEMVision review recipes and prepare defect reports for cross-functional teams.
• Support tool qualification, baseline defect monitoring and excursion response.

Required profile

• Bachelor's or Master's degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or a related field.
• 2+ years of experience in semiconductor defect review, yield, process or FA engineering preferred; strong new graduates with relevant internship or research experience are welcome.
• Basic knowledge of front-end and back-end process flows (litho, etch, deposition, CMP, implant, clean).
• Working knowledge of yield analysis concepts such as defect density, kill ratio, defect Pareto and wafer map signatures.

Required skills

• Hands-on experience with SEM / defect review SEM (e.g. SEMVision) is a strong plus.
• Familiarity with FA techniques (FIB, TEM, EDX/EDS, Auger, SIMS) and interpretation of FA results.
• Data analysis tools such as JMP, Excel and Klarity/yield management systems; Python or scripting is a plus.
• Root-cause methods such as 8D, 5-Why and fishbone diagrams.