Principal Tape Out Engineer

About the role

The Principal Tape Out Engineer is responsible for the final checkpoint in the semiconductor design flow, ensuring that design data meets all manufacturing requirements before fabrication. This role works closely with design, program management, technologists, and manufacturing teams to resolve issues and optimise outcomes.

Key responsibilities

• Coordinate and execute the tape‑out process for semiconductor products, delivering design data to manufacturing on schedule.
• Verify design integrity by reviewing databases and documentation, addressing any discrepancies.
• Collaborate with cross‑functional teams—including design, technologists, program managers, and process engineering—to resolve technical issues and improve manufacturability.
• Ensure all deliverables conform to foundry requirements and maintain detailed records of procedures and revisions.

Required profile

• Bachelor’s degree in Electrical or Computer Engineering (Master’s preferred).
• Experience with physical design tools and semiconductor manufacturing workflows.
• Excellent attention to detail, problem‑solving skills and ability to work under tight deadlines.
• Willingness to work flexible hours to support critical tape‑outs.
• Effective communication in English for collaboration across technical teams.

Required skills

• Cadence
• Synopsys