Process Engineering Manager (Electroplating)

About the role

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to join its Singapore Advanced Packaging Development Center (APDC) team. The role leads the development and optimization of next-generation electroplating processes and technologies for advanced semiconductor packaging, manages a team of engineers, drives process innovation, supports customer engagements and collaborates with global cross-functional teams.

Key responsibilities

• Manage engineers in characterizing hardware, defining methods and new technologies and applying them to characterize hardware or perform characterization on complex systems across the product range.
• Manage, develop, plan and execute process engineering projects for the full product range.
• Work with key customers to resolve complex process engineering issues.
• Develop and implement new technology, products and analytical instrumentation.
• Train staff, define and apply new methodologies, and troubleshoot and resolve complex issues, including root cause analysis.
• Generate internal and external documentation, presentations and technical reports, and validate process engineering specifications.
• Contribute to market share gains through technology improvement.

Required profile

• Bachelor's, Master's or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering or a related field.
• 8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating/electrochemical deposition.
• Proven experience leading process development, technology innovation and product qualification in an R&D environment.
• Demonstrated people leadership experience developing and mentoring engineering teams.
• Experience collaborating with customers and cross-functional teams on complex technical challenges.

Required skills

• Copper plating, wafer-level packaging, RDL, copper pillars, TSVs and advanced packaging.
• Process characterization, DOE, statistical analysis, troubleshooting and root cause analysis.
• Plating chemistry, deposition uniformity, defect reduction and process optimization.
• Ability to write technical reports, specifications and executive presentations.

The work location is Science Park II, moving to the Tampines office from April 2027. The position is full-time, regular, with travel of about 10% of the time and relocation eligibility.