Product Integration Lead, HIG High Bandwidth Memory

About the role

Micron Technology is hiring a Product Integration Lead for its HIG HBM Product Development Team. The role integrates Micron's leading-edge HBM products into end-system requirements and drives the HBM development swimlane requirements (SCD) to meet end-system needs. It also sets product development priorities and manages new change requests, resolving technical challenges within schedule, risk and incremental cost boundaries.

Key responsibilities

• Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD).
• Work with HBM Architecture, Product and Systems Engineering, Business Unit, Technology Development, Packaging and Global Quality teams to close gaps between HBM commits and system requirements.
• Manage HBM sample delivery in line with system development needs and timelines, and assist with risk assessment of identified issues.
• Lead triage of system or chip feature interactions, coordinate mitigations with stakeholders and drive qualification definition and changes, including the Change Control Board for late/post-qualification changes.
• Prioritize work within the HBM development team to keep focus on system specs and address concerns with component and system teams.
• Use AI to streamline workflows, optimize processes and enable data-driven decisions across projects and teams.

Required profile

• Bachelor's or Master's degree in Electrical or Computer Engineering.
• 8+ years of demonstrated ability in product, design, process, yield enhancement or related engineering fields.
• Experience with product development projects is preferred.
• Proven ability to lead technical issues to closure through collaboration.
• Excellent interpersonal, communication and presentation skills.

Required skills

• Programming in Python, Java, C or VB.
• Tableau and PowerBI development experience is a plus.
• Knowledge of DRAM/HBM device, design and system management is beneficial.