Product Integration Lead, HIG High Bandwidth Memory

About the role

Micron Technology is hiring a Product Integration Lead for its HIG HBM Product Development Team. The role integrates Micron's leading-edge HBM products into end-system requirements and drives the HBM development swimlane requirements (SCD) to meet end-system needs. It also sets product development priorities and manages new change requests, resolving technical challenges within schedule, risk and incremental cost boundaries.

Key responsibilities

• Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD).
• Work with HBM Architecture, Product and Systems Engineering, Business Unit, Technology Development, Packaging and Global Quality teams to close gaps between HBM commitments and system requirements.
• Understand sample usage and capability gaps, manage HBM sample delivery in line with system development timelines, and assist with risk assessment of issues.
• Lead triage of system or chip feature interactions, coordinate mitigations with stakeholders, and manage qualification definition and changes, including the Change Control Board for late/post-qualification changes.
• Communicate priorities within the HBM development team to keep focus on system specifications.
• Use AI to streamline workflows, optimize processes and enable data-driven decisions across projects and teams.

Required profile

• Bachelor's or Master's degree in Electrical or Computer Engineering.
• 10+ years of demonstrated ability in product, design, yield enhancement or related engineering fields; product development project experience is a plus.
• Proven ability to lead technical issues to closure through collaboration.
• Interest in developing knowledge of HBM-to-system development.
• Knowledge of DRAM/HBM device, design and system management is beneficial.
• Strong interpersonal, communication and presentation skills.