Product & System Engineer, HBM Manufacturing

About the role

Micron is looking for an experienced Product & System Engineer for its High Bandwidth Memory (HBM) team in Media Health Manufacturing. The role works on Micron's next-generation HBM products, including DRAM and interface dies and stacked products, and focuses on the KPIs of quality, cost, cycle time and scale. It sits in a high-performing team and works closely with cross-functional groups such as Fab, Product Leads, Design, Technology Development and Test Solution Engineering.

Key responsibilities

• Ensure optimized test coverage on current and future HBM designs and process nodes.
• Develop, validate, characterize and qualify next-generation HBM products, supporting design verification with CAD tools and Verilog simulations.
• Improve manufacturing test yields for device, interface and stacked die issues, reduce test time and resolve yield-related problems.
• Root cause and resolution of manufacturing test flow, qualification and RMA device issues.
• Promote innovation and drive changes that give Micron a technical advantage over competitors.
• Manage projects efficiently and make final decisions on risk analysis and project prioritization.
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams.

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.
• Solid problem-solving approach focused on root cause analysis.
• Familiarity with CMOS technology, DRAM architecture and basic device physics.
• Exposure to data analysis, statistics and scripting tools such as Python or JMP is a plus.
• Flexible and eager to learn in a dynamic engineering environment.