Product & System Engineering Engineer, HBM Manufacturing

About the role

Micron is looking for an experienced engineer for its High Bandwidth Memory (HBM) Product & System Engineering team in Media Health Manufacturing. The team drives manufacturing and activities for Micron's HBM products, including DRAM and interface dies and stacked products, focusing on quality, cost, cycle time and scale. The role works closely with cross-functional teams such as Fab, Product Leads, Design, Technology Development and Test Solution Engineering.

Key responsibilities

• Ensure optimized test coverage on current and future HBM designs and process nodes for high-volume manufacturing.
• Develop, validate, characterize and qualify next-generation HBM products, supporting design verification with CAD tools and Verilog simulations.
• Improve manufacturing test yields for device, interface and stacked die issues, reduce test time and resolve yield-related problems.
• Root cause and resolution of manufacturing test flow, qualification and RMA device issues.
• Promote innovation and drive changes that give Micron a technical advantage over competitors.
• Manage projects efficiently and make final decisions on risk analysis and project prioritization.
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams.

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.
• Coursework or internship experience in semiconductor devices, circuit design or product validation is a plus.
• Solid problem-solving approach focused on root cause analysis.
• Flexible and eager to learn in a dynamic engineering environment.

Required skills

• Familiarity with CMOS technology, DRAM architecture and basic device physics.
• Exposure to data analysis, statistics and scripting tools such as Python or JMP.