Senior Engineer - Package Health System and Analytics

About the role

Micron is hiring a Staff/Senior Engineer for its Package Health System and Analytics team. The engineer contributes to developing and running package health monitoring, simulation and characterization activities, working hands-on in DFT, data analysis and reliability testing to deliver robust packaging solutions.

Key responsibilities

• Define quantitative package health metrics and develop detection mechanisms and monitoring dashboards for continuous health assessment.
• Perform electrical and mechanical characterization of packages.
• Implement real-time defect detection and classification (critical vs. non-critical) and carry out deeper characterization of critical defects, feeding results into predictive models.
• Run correlation and causation studies between process variables, defect patterns and reliability outcomes.
• Build and maintain a knowledge base of package health learnings to support NPI handover and future technology development.
• Work with process and equipment engineers to set up traceability across wafer, assembly and test stages, and build data pipelines linking process parameters, equipment signals and defect signatures.
• Use AI-assisted tools to improve efficiency, quality and effectiveness, and share AI-enabled improvements with the team.

Required profile

• Bachelor's or Master's degree in Electrical Engineering, Materials Science or a related field.
• 3+ years of experience in the semiconductor industry (complex products preferred), preferably in packaging, test or reliability engineering.
• Strong data analytics and statistical modeling skills.
• Knowledge of semiconductor packaging processes, material interactions and properties.
• Ability to work cross-functionally with process, equipment and reliability teams.

Required skills

• Proficiency in Python/R for data analysis and visualization is a plus.
• Experience with AI/ML tools or statistical modeling.
• Defect inspection systems and inline metrology.
• Familiarity with advanced packaging technologies such as HBM, hybrid bonding and 2.5D/3D stacking.
• Strong problem-solving and documentation skills.