Senior FEA Modeling Engineer - Advanced Packaging

About the role

Applied Materials is looking for an experienced Senior FEA Modeling Engineer to join its Advanced Packaging Modeling team in Singapore. The engineer will independently lead complex thermal-mechanical simulation projects that influence package architecture, material selection, process windows, qualification strategy and reliability risk reduction. The role needs about five or more years of relevant industrial experience and strong technical judgment.

Key responsibilities

• Independently define, develop, validate and deploy high-fidelity FEA models for advanced semiconductor packages.
• Lead thermo-mechanical reliability modeling for thermal cycling, process-induced stress, fatigue, creep, delamination and interfacial failure.
• Analyze stress, strain, warpage, creep, plasticity and viscoelasticity in flip-chip, fan-out, 2.5D/3D IC, chiplet, TSV, HBM and hybrid-bonded structures.
• Develop thermal and coupled multi-physics models to guide design, material tradeoffs, process integration and cooling concepts.
• Translate business and engineering questions into simulation requirements, validation plans and decision-ready outputs.
• Plan sensitivity analyses, design-of-experiments, optimization and uncertainty assessments.
• Correlate models with metrology, material characterization, reliability testing and failure analysis, and calibrate constitutive models.
• Mentor junior engineers, set modeling best practices and drive automation and standardization.

Required profile

• M.S. or Ph.D. in Mechanical Engineering, Materials Science, Applied Mechanics, Applied Physics or a related field.
• At least five years of industrial experience in thermal-mechanical FEA, preferably in semiconductor packaging or a high-reliability domain.
• Strong knowledge of advanced packaging architectures and processes (die attach, underfill, molding, bumping, bonding, reflow, wafer-level processes).
• Proven ability to validate models, diagnose numerical and physical issues and communicate to technical and leadership audiences.

Required skills

• ANSYS, Abaqus, COMSOL or an equivalent commercial FEA platform, including nonlinear and temperature-dependent material modeling.
• Preferred: coupled electro-thermal-mechanical, fracture, cohesive-zone, creep, viscoelastic, submodeling, HBM, hybrid bonding, FOWLP, chiplets, JEDEC qualification methods.
• Preferred: Python, MATLAB, APDL, TCL, optiSLang, optimization, surrogate modeling and uncertainty quantification.