Senior Member of Technical Staff - CMP Process Development, NAND

About the role

Micron is hiring a Senior Member of Technical Staff (SMTS) for its Next Generation NAND research and development CMP team. This is a module-level CMP technical authority who defines CMP technical direction, leads first-of-a-kind (FOAK) developments and drives cross-functional execution across NAND nodes. The role works closely with process integration and areas such as wet etch, CVD, diffusion, metals, lithography and dry etch.

Key responsibilities

• Own and lead key NAND CMP process modules, turning technology challenges into executable roadmaps across current and future nodes
• Drive cross-functional execution across Technology Development, Process Integration, Manufacturing and Equipment teams
• Lead FOAK CMP process development, including recipe architecture, control strategies and integration alignment
• Ensure process robustness and manufacturability through run-to-run controls, SPC, qualification execution and risk mitigation
• Solve complex yield, defectivity and integration issues using model-based and data-driven approaches
• Define and execute process-level hardware strategies with equipment suppliers
• Mentor engineers, build subject matter expert pipelines, publish internal papers and present to senior leadership
• Integrate AI-assisted tools into daily work and share AI-enabled improvements

Required profile

• PhD with at least 12 years, or Master's degree with at least 15 years, of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field
• Experience in CMP process development and deep expertise in CMP chemistry, physics and integration
• Publications, patents and a strong record of technical contributions
• Demonstrated technical leadership in problem solving and ability to influence without authority across process integration, equipment and manufacturing teams

Required skills

• In-depth knowledge of CMP fundamentals, including pad-sluurry-wafer interactions, slurry chemistry and pattern density effects
• Understanding of multiple CMP process types (metal, dielectric, barrier/hardmask, poly-Si/Si)
• Hands-on experience with advanced 300 mm CMP platforms
• Statistical process control (SPC), data analysis and qualification methodologies