Senior Quantum 3D Integration and Packaging Engineer

About the role

Applied Materials' CTO group focuses on solid-state quantum technology, including superconducting qubits and optical quantum computing, and aims to build quantum devices with lower error rates through materials engineering, semiconductor processing and advanced optics. It is seeking a technologist with a strong semiconductor and 3D integration background to develop advanced packaging solutions for emerging quantum markets. The position is based in Singapore.

Key responsibilities

• Create 3D integration and packaging solutions for different platforms and quantum structures
• Work with the advanced packaging, process, hardware and metrology teams to develop new materials, processes and structures for quantum devices
• Design, collect data, analyze and compile reports on difficult process engineering experiments within safety guidelines
• Troubleshoot complex problems, perform root cause analysis and resolve process engineering issues
• Generate internal and external documentation for products, presentations and technical reports
• Design and run experiments, measure material and device properties and interpret data
• Stay up to date with 3D integration, quantum information and related fields and implement new technologies
• Collaborate with customers, start-ups or universities to identify key problems and develop solutions

Required profile

• PhD, Master's or Bachelor's degree in Materials Science, Electrical Engineering, Physics, Microelectronics or a related field
• 5+ years of experience in advanced packaging, 3D integration, heterogeneous integration or semiconductor process development
• Familiarity with quantum devices, superconducting technologies, photonics or cryogenic systems is a strong plus

Required skills

• Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets and flip-chip technologies
• Hands-on experience in semiconductor fabrication, process integration, materials characterization and metrology
• Experience with DOE, data analysis, process optimization and root cause analysis
• Strong problem-solving, technical communication and cross-functional collaboration skills