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Senior/Staff Equipment Development Engineer (APTD)

micron · Fab 10A

New
Senior 🇬🇧 English
Python SQL Visual Basic SPC DOE FDC MES E3 FDC RMS

Job description

About the role

Micron is hiring a Senior/Staff Equipment Development Engineer (APTD) at its Fab 10A site. The role develops and optimizes advanced packaging equipment for technology enablement, including wafer-level packaging and stacking, and works with process development teams to improve equipment capability, reduce costs and boost productivity.

Key responsibilities

  • Develop and optimize advanced packaging equipment, including wafer-level packaging and stacking, and establish hardware roadmaps for 5+ years in post-probe wafer and die processing
  • Improve equipment capability, enable process improvements, reduce costs and enhance productivity
  • Set up and improve equipment management projects to deliver tech node requirements, and evaluate new equipment and materials
  • Ensure defense coverage through process, measurement, inspection and testing, and establish correlations between defense mechanisms
  • Work with the SMAI team on continuous data analysis to set advanced controls and find improvement opportunities
  • Collaborate with Process Development teams and lead the equipment team to work with Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering and Global Quality
  • Lead the transition from new product development and qualification to small-volume and then high-volume production
  • Build forecasts, proposals and strategic/tactical plans based on business data and market intelligence

Required profile

  • B.S./M.S./Ph.D. (or equivalent) in Materials Science, Chemical, Electrical or Mechanical Engineering, Physics or a related technical field
  • 5+ years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging
  • Experience developing FOAK hardware and improving equipment maturity
  • Understanding of wafer bonding, plating, warpage control and packaging, and of inline/electrical/probe failures
  • Strong problem-solving and root cause analysis skills

Required skills

  • Preferred: Python, R, SQL for statistical analysis, process modeling and data analytics
  • Preferred: Visual Basic for automation and tool integration
  • Familiarity with E3, FDC (Fault Detection and Classification) and RMS (Recipe Management System)
  • Preferred: knowledge of MES, ETO, Autoshell and E3 FDC
  • Strong data analytics for SPC, DOE, defect analysis and dashboarding

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Source : ats:workday

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Published 9 hours ago

Expires 1 month from now

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micron

Fab 10A