Senior/Staff/Principal - Advanced Packaging Process Integrator

About the role

Micron is hiring a Senior/Staff/Principal Advanced Packaging Process Integrator at its Fab 10A site. As part of the APTD SG Technology Development Process Integrator team, you will develop advanced packaging process solutions and ensure the success of new process, new equipment, new material and path-finding activities for advanced packaging products. You will lead new Technode process readiness and improve yield, quality and reliability through process characterization and optimization.

Key responsibilities

• Drive and collaborate with cross-functional teams to resolve process-related problems and enable the best technology for new Technode with packaging requirements.
• Ensure a smooth transition from new process development and first qualification to small-volume production launch.
• Develop and qualify new packaging processes, materials, equipment and technologies to meet Technode requirements and schedule.
• Perform CPI NUDD, process TRA, risk mitigation and recipe readiness before silicon arrives, ensuring a first-pass rate.
• Identify path-finding opportunities for technology leadership, including BIC time-to-market, continuous yield improvement, cost efficiency and touchpoint optimization.
• Integrate process knowledge between upstream and downstream across silicon and assembly/packaging, and define process capabilities, strategy and roadmap.
• Work with teams to set up new capabilities that enhance process performance and deliver new solutions on time.

Required profile

• PhD, Master's or Bachelor's degree in Electrical/Electronic, Material, Mechanical Engineering, Physics or Applied Physics, or equivalent.
• 6 years or more of experience in the semiconductor industry.
• Experience in frontend fab process integration or module process, and in backend advanced packaging wafer/die-level process or integration.
• Understanding of silicon integration and how it interacts at backend process and package level through CPI.
• Strong project management, communication and presentation skills, and ability to work with cross-functional teams.

Required skills

• Proficiency with simulation tools and data analytics platforms for performance analysis and optimization.
• Experience with temporary or permanent bonding technology (wafer-on-wafer, chip-on-wafer) is a plus.