Sr. Principal Foundry Engineer – Logic/RF Device Expert

About the role

The APAC Central Competence Team partners with external foundries to ensure robust chip supply and technology enablement for NXP’s business lines. This senior position leads advanced node technology ramp‑up and transfer for logic and RF devices, driving new technology introduction and process transfers.

Key responsibilities

• Collaborate with foundries, NXP technology teams and business lines to qualify and release advanced FinFET processes.
• Provide technical leadership in semiconductor device physics, focusing on FinFET architecture and behavior.
• Interface with internal and external stakeholders on critical development and transfer projects.
• Lead projects to meet timelines, business objectives and make key decisions on process integration.
• Support NTI process transfers within foundries and NXP joint ventures.

Required profile

• Bachelor’s or Master’s degree in Electrical Engineering, Physics or a related field.
• Minimum 10 years of experience in semiconductor device engineering with a focus on advanced logic/RF devices.
• Proven hands‑on experience with HKMG and FinFET technologies in production or development environments.
• Fluency in spoken Mandarin for regular interaction with Mandarin‑speaking suppliers.
• Demonstrated leadership in development, transfer or ramp‑up projects and strong communication skills.

Required skills

• HKMG technology
• FinFET technology
• Semiconductor device physics
• Yield enhancement analysis
• Electrical data analysis