Technical Sales Engineer – Semiconductor Packaging

About the role

We are looking for a Technical Sales Engineer to join our Singapore office and support the Asia‑Pacific commercial team. You will act as the technical bridge between customers and our engineering department, delivering tailored semiconductor back‑end packaging solutions.

Key responsibilities

• Prepare technically sound proposals, sales materials, specifications and quotations for customers.
• Translate customer requirements into mechanical system solutions and advise on equipment configuration.
• Collaborate with internal Engineering, R&D and Project teams to ensure alignment with Boschman product platforms.
• Identify and develop new business opportunities across the Asia‑Pacific region.
• Define machine concepts, layouts and customisations from a mechanical engineering perspective.
• Maintain long‑term customer relationships, manage the sales funnel and represent the company at industry events.

Required profile

• MSc or BSc in Mechanical Engineering (mandatory).
• Minimum 5 years of experience in a technical‑commercial role within high‑tech or semiconductor equipment industries.
• Strong hands‑on knowledge of mechanical engineering for complex production equipment and industry standards.
• Proven ability to review and challenge customer specifications and translate them into ready‑to‑use solutions.
• Excellent verbal and written communication skills in English and Chinese.

Required skills

• Mechanical Engineering for semiconductor back‑end manufacturing.
• SolidWorks (or equivalent 3D design system).
• Machine architecture and module concept design.
• Understanding of equipment design principles for molding and sintering processes.