Technology Development Engineer – Hybrid Bonding & Advanced Packaging Internship

About the role

Join Applied Materials in Singapore as a Technology Development Engineer intern, focusing on hybrid bonding and advanced packaging. You will work with the Process Integration team to develop and characterize test vehicles for chip‑to‑wafer and wafer‑to‑wafer applications, gaining hands‑on experience in semiconductor fabrication and statistical analysis.

Key responsibilities

• Develop process flows and experimental designs for advanced packaging building blocks such as redistribution layers, damascene copper structures, and wafer‑level interconnects.
• Characterize defects, analyze data, and correlate process parameters with electrical and physical performance metrics.
• Support R&D projects by documenting results and contributing to integration of hybrid bonding processes.

Required profile

• Current student in Electrical Engineering, Materials Science, or a related discipline.
• Strong analytical mindset with ability to interpret experimental data.
• Interest in semiconductor manufacturing and advanced packaging technologies.

Required skills

• Knowledge of hybrid bonding and advanced packaging concepts.
• Familiarity with redistribution layer (RDL) and damascene copper processes.
• Experience with statistical data analysis and experimental design.

What we offer

• Supportive work culture encouraging learning and professional growth.
• Exposure to cutting‑edge semiconductor equipment and processes.
• Access to company benefits focused on health, wellbeing, and development.