Yield Enhancement Engineer – Package Development

About the role

The Yield Enhancement Engineer in Package Development Engineering (PDE) is responsible for yield monitoring, excursion management and yield stabilization during High Bandwidth Memory (HBM) New Product Introduction (NPI). The role ensures robust yield performance from first silicon through ramp‑up and early high‑volume manufacturing, partnering closely with Process Integration, MRDA, Process Engineering, Assembly/Test Manufacturing and Quality teams.

Key responsibilities

• Account for HBM NPI builds across Post Wafer Finishing, Assembly and test, performing defect breakdown and Physical Failure Analysis submissions.
• Collaborate with Process Integration to identify defect sources and develop Continuous Improvement Plans.
• Maintain yield dashboards and trackers, supporting real‑time defect analysis and statistical process control.
• Analyze yield deviation issues, trigger corrective actions, and support block‑run and partial‑conversion yield analysis.
• Work with Process Control Systems to integrate SPC and Fault Detection & Classification charts into Yield Loss Ratio monitoring.
• Identify and propose yield improvement opportunities using AI‑assisted tools and auto‑diagnostic software.
• Drive fast learning cycles, early risk detection and disciplined yield recovery throughout NPI builds.

Required profile

• Experience with HBM NPI builds and post‑wafer finishing processes.
• Proven ability to perform defect analysis, Physical Failure Analysis and Real‑Time Defect Analysis.
• Strong collaboration skills with cross‑functional teams (PI, PE, MRDA, Assembly/Test, Quality).
• Familiarity with NPI phase‑gates, yield best practices and continuous improvement methodologies.

Required skills

• AI‑assisted analysis tools
• Statistical Process Control (SPC)
• Fault Detection & Classification (FDC)
• Physical Failure Analysis (PFA)
• Real‑Time Defect Analysis (RDA)
• Yield dashboard creation and maintenance
• Auto‑diagnostics software