Senior SMT PCBA Manufacturing / Process Engineer

About the role

Jabil is looking for a Senior SMT PCBA Manufacturing / Process Engineer to develop, optimize and sustain Surface Mount Technology (SMT) and Printed Circuit Board Assembly (PCBA) manufacturing processes. The role provides technical leadership for NPI, process validation, yield improvement, equipment qualification, automation initiatives and continuous improvement, while supporting high-volume production and customer requirements.

Key responsibilities

• Own SMT and PCBA processes from stencil printing through reflow, AOI, SPI, selective soldering, wave soldering, depanelization, coating and final assembly, and lead troubleshooting and root cause investigations
• Develop and maintain process flows, control plans, PFMEA, work instructions and process specifications, and monitor Cp/Cpk
• Lead DFM/DFA reviews, pilot builds, engineering builds, ramp-up, training and product transfers
• Optimize solder paste printing, reflow profiles, AOI/SPI, selective and wave soldering, and establish process windows to improve first-pass yield
• Lead equipment selection, qualification and commissioning, and support automation and Industry 4.0 initiatives
• Lead IQ/OQ/PQ, process validation, gauge R&R, MSA, SPC and capability studies, and support customer, ISO and regulatory audits
• Lead Lean, DMAIC, Kaizen, value stream mapping and OEE projects, and drive cost reduction
• Mentor engineers, coach technicians, interface with customers and lead engineering reviews

Required profile

• Bachelor's degree in Electronics, Electrical, Manufacturing, Mechanical or Industrial Engineering or a related discipline
• 8+ years of SMT/PCBA manufacturing engineering experience, minimum 5 years on high-volume SMT production
• Experience with NPI, process validation and yield improvement
• Preferred: 10+ years in EMS, experience in a major EMS or high-mix environment, Lean Six Sigma Green or Black Belt, and experience leading manufacturing transfers and multi-site deployments

Required skills

• SMT process development, stencil design, solder paste, pick-and-place programming, reflow profiling, AOI, SPI, X-Ray, wave and selective soldering, PCB defect analysis, conformal coating
• SPC and Minitab, DMAIC and Lean Six Sigma, PFMEA, control plans, 8D, fishbone and 5 Why analysis, time study
• IPC-A-610, IPC J-STD-001, IPC-7711/7721, ISO 9001, ISO 13485 (preferred), FDA 21 CFR Part 820 (preferred), ESD control, change control and CAPA