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Senior Thermal/Hardware Engineer

hpe · Singapore

New
Senior 🇬🇧 English
CFD FloTHERM Python Thermal design Electronics packaging

Job description

About the role

Hewlett Packard Enterprise is hiring a Senior Thermal/Hardware Engineer in Singapore, an onsite position based primarily in an HPE office. The role leads thermal design, simulation and validation for high-density, high-power networking platforms, from early concept through mass production, and guides junior engineers and external partners.

Key responsibilities

  • Lead system-level thermal design, simulation and validation for high-density, high-power networking platforms, owning the full lifecycle from heatsink design and CFD simulation to in-lab testing and data analysis.
  • Design and validate thermal solutions for electronics enclosures, chassis and line cards, and define thermal validation test plans covering thermal margin, acoustics, shock/vibration, reliability and safety.
  • Drive system-level design tradeoffs with mechanical, electrical, power, firmware and software teams, and represent the thermal team across large development programs.
  • Work with manufacturing partners, suppliers and external developers to deliver production-ready thermal solutions, and lead root-cause analysis and corrective actions.
  • Mentor less-experienced engineers and guide them on thermal design, lab testing, prototype fabrication and production tooling.

Required profile

  • Bachelor's or Master's degree in Mechanical Engineering or a related field.
  • 10+ years of experience in thermal design and electronics packaging, with a track record leading thermal development on networking platforms.
  • Proven technical leadership, able to drive complex, multi-disciplinary projects and communicate thermal strategies to engineering peers and senior leadership.

Required skills

  • Deep expertise in thermal design and electronics packaging for data center and networking systems.
  • Proficiency in CFD tools such as FloTHERM, with models correlated against lab measurements.
  • Hands-on experience with thermocouples, DAQs, environmental/thermal chambers and airflow/pressure benches.
  • Ability to write test automation and data analysis scripts in Python or similar.
  • Experience designing heatsinks, sheet metal, plastic parts, ducts and baffles, and working with vendors on design-for-manufacturability.

Questions fréquentes

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Source : ats:workday

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Published 2 hours ago

Expires 1 month from now

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hpe

Singapore