Senior Thermal/Hardware Engineer
hpe · Singapore
Job description
About the role
Hewlett Packard Enterprise is hiring a Senior Thermal/Hardware Engineer in Singapore, an onsite position based primarily in an HPE office. The role leads thermal design, simulation and validation for high-density, high-power networking platforms, from early concept through mass production, and guides junior engineers and external partners.
Key responsibilities
- Lead system-level thermal design, simulation and validation for high-density, high-power networking platforms, owning the full lifecycle from heatsink design and CFD simulation to in-lab testing and data analysis.
- Design and validate thermal solutions for electronics enclosures, chassis and line cards, and define thermal validation test plans covering thermal margin, acoustics, shock/vibration, reliability and safety.
- Drive system-level design tradeoffs with mechanical, electrical, power, firmware and software teams, and represent the thermal team across large development programs.
- Work with manufacturing partners, suppliers and external developers to deliver production-ready thermal solutions, and lead root-cause analysis and corrective actions.
- Mentor less-experienced engineers and guide them on thermal design, lab testing, prototype fabrication and production tooling.
Required profile
- Bachelor's or Master's degree in Mechanical Engineering or a related field.
- 10+ years of experience in thermal design and electronics packaging, with a track record leading thermal development on networking platforms.
- Proven technical leadership, able to drive complex, multi-disciplinary projects and communicate thermal strategies to engineering peers and senior leadership.
Required skills
- Deep expertise in thermal design and electronics packaging for data center and networking systems.
- Proficiency in CFD tools such as FloTHERM, with models correlated against lab measurements.
- Hands-on experience with thermocouples, DAQs, environmental/thermal chambers and airflow/pressure benches.
- Ability to write test automation and data analysis scripts in Python or similar.
- Experience designing heatsinks, sheet metal, plastic parts, ducts and baffles, and working with vendors on design-for-manufacturability.
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Published 2 hours ago
Expires 1 month from now
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hpe
Singapore