Silicon Product Integration Engineer (MEMS)

About the role

HP is looking for an experienced Product Engineer to lead silicon product engineering, foundry engagement and NPI execution for next-generation MEMS programs. The role acts as the technical bridge between HP, foundry partners, design teams, manufacturing organisations and worldwide program teams, driving product execution from technology development through qualification to production launch.

Key responsibilities

• Lead silicon product engineering across development, qualification, ramp and sustaining phases, including wafer and advanced packaging factory deliverables.
• Drive structural cost savings in wafer foundry and advanced packaging factories, and lead NPI silicon builds.
• Partner with design, architecture, reliability, systems and manufacturing teams to resolve technical issues and process marginality escalations.
• Serve as the main technical interface with internal and external foundries, covering technical reviews, process optimisation, design enablement, qualification and root-cause investigations on yield, reliability and manufacturability.
• Manage technical schedules, milestones, dependencies and risk mitigation plans, and coordinate worldwide teams across design, process, integration, manufacturing, supply chain and program management.

Required profile

• Bachelor's, Master's or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Semiconductor Engineering, Physics or a related discipline.
• 8+ years of semiconductor industry experience, including direct work with foundries.
• Experience leading cross-functional development programs and making technical decisions across organisations.
• Preferred: MEMS development, NPI and high-volume manufacturing launch, and program management experience for complex technical programs.

Required skills

• Product engineering, yield engineering, process integration, device engineering and failure analysis.
• Strong communication and stakeholder management skills.

What we offer

• Full-time position with no shift premium.
• 25% travel allowance.
• No relocation package.