College Intern - Process and Digitalization

About the role

HP is looking for a College Intern in Process and Digitalization in Singapore. The intern works with the engineering team to develop solutions for the manufacturing operation using AI, IIoT, smart vision systems and other automation solutions, and helps build smart factory solutions with a team of engineering and operations executives.

Key responsibilities

• Develop manufacturing solutions using AI, IIoT, smart vision systems and other automation.
• Carry out practical work on high-speed, high-precision die attach equipment, wire bonders, chip attach, high-precision over-mold tools and other semiconductor packaging tools in a high-volume manufacturing environment.
• Take part in concurrent projects covering current production, sustainability and new product introduction.
• Innovate and define improved manufacturing processes through methodical study.

Required profile

• Master's or Bachelor's degree in Mechanical, Manufacturing, Automation, Computer Engineering, Data Science/Analytics/AI or a related field.
• Able to commit to a 5-6 month full-time internship starting in January 2027.
• Willingness to learn and clear communication within a team.
• Ability to work both as a team member and independently.

Required skills

• Advantageous: applied skills with Power BI, Power Automate and/or robotic process automation.
• Advantageous: knowledge of AI, IIoT, digitalization, machine learning and software programming.