Manufacturing Design Engineer - Camera Electronics

About the role

KLA's Global Operations team, which includes Manufacturing Engineering, is looking for a TDI Camera Manufacturing Design Engineer in Singapore. The engineer owns the technical, quality and manufacturing performance of assigned camera electronic assemblies and subassemblies, supports production issues and field escalations, and works with suppliers and cross-functional teams to improve product quality and yield.

Key responsibilities

• Drive resolution of production issues to minimise disruptions and support shipment commitments.
• Provide technical support for field escalations, customer issues and product sustaining activities.
• Lead non-conformance investigations and disposition, working with suppliers and cross-functional teams.
• Conduct failure analysis, root-cause investigation and corrective/preventive actions for electrical and electronic failures.
• Support supplier quality, manufacturing yield and process improvements through data-driven problem solving.
• Support component EOL/obsolescence replacement, supplier/site transfers and other engineering initiatives.
• Create, review and implement Engineering Change Orders (ECOs).
• Monitor and improve supplier manufacturing performance, product quality and test yield.
• Support ICT and functional test development, debug, troubleshooting, validation and supplier technical training.
• Participate in design reviews and ensure designs meet DFM and DFT requirements.
• Support New Product Introduction, including manufacturing documentation, test readiness, supplier readiness and production qualification.
• Collaborate with Design Engineering, Manufacturing, Quality, Materials and suppliers for product transfer and ramp-up, and maintain technical documentation.

Required profile

• BS/MS in Electronics Engineering, Electrical Engineering or a related discipline.
• Preferred: 3 years of relevant industry experience; alternatively a doctorate with 0 years of experience, or a master's degree with 3 years, or a bachelor's degree with 5 years.
• Experience with camera electronics, imaging systems, image sensors or camera-related data acquisition systems is an advantage.
• Willingness to travel up to 25% for NPI, supplier training, site transfers and technology transfers.

Required skills

• FPGA, ADC/DAC, high-speed digital, analog electronics and signal integrity.
• PCBA manufacturing, testing, assembly and quality processes.
• Troubleshooting, failure analysis and diagnostics at test-bench and system levels.