Process Development in PVD Ventura Chambers for TSV Application

About the role

Join Applied Materials in Singapore to support the development of physical vapor deposition (PVD) processes for TSV applications. Under engineer guidance, you will perform experiments, collect data, and analyze results to improve PVD product performance.

Key responsibilities

• Assist in PVD process optimization and measurement of metal film properties.
• Organize experimental data and prepare reports for review.
• Conduct hardware characterization on moderately complex systems while following safety guidelines.
• Participate in troubleshooting, root‑cause analysis, and resolution of moderately difficult process engineering issues.

Required profile

• Student or recent graduate in Materials Science, Electrical Engineering, or a related field.
• Ability to work under guidance, follow safety procedures, and communicate findings clearly.

Required skills

• Physical vapor deposition (PVD) process knowledge.
• Metal film property measurement techniques.
• Hardware characterization of deposition equipment.
• Root cause analysis and basic troubleshooting.

What we offer

• Supportive work culture that encourages learning and development.
• Opportunities to work on cutting‑edge semiconductor equipment.
• Access to employee health and wellbeing programs.