Process Support Engineer – Advanced Packaging

About the role

As a Process Support Engineer you will guide advanced packaging products through their full lifecycle, from concept to qualification, providing on‑site customer support and troubleshooting complex semiconductor equipment.

Key responsibilities

• Perform on‑site installations, system diagnoses, and service/repair of high‑visibility equipment.
• Collaborate with customers and R&D to develop cutting‑edge processes for advanced semiconductor chips.
• Create hypothesis experiments and design of experiments (DOE), analyse data statistically, and compile technical reports.
• Troubleshoot complex issues, conduct root‑cause analyses, and resolve process engineering challenges.

Required profile

• Bachelor’s degree in chemistry, physics, materials engineering, electrical engineering, optoelectronics or a related field.
• More than 2 years of experience in semiconductor processes, preferably hybrid bonding/advanced packaging.
• Strong interpersonal and communication skills for customer interaction.
• Willingness to travel to customer sites across Singapore.

Required skills

• Chemical Vapor Deposition (CVD)
• Atomic Layer Deposition (ALD)
• Plasma Reactive Ion Etch (RIE)
• Physical Vapor Deposition (PVD)
• Anneal processes
• Implant processes
• Design of Experiments (DOE)
• Statistical data analysis

What we offer

• Supportive work culture that encourages learning and career growth.
• Comprehensive health and wellbeing programs.
• Opportunities to work on cutting‑edge semiconductor technology.