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Research Associate – Adhesive Bonding & Debonding Instrumentation

NTU · Singapore

New
Junior 🇬🇧 English
adhesive bonding technology mechanical testing machine learning

Job description

About the role

The Aumovio‑NTU Corporate Laboratory Centre seeks a Research Associate to investigate bonding and debonding of adhesively bonded hybrid joints using modified adhesives. The role focuses on developing low‑preparation rebonding processes that meet original design specifications.

Key responsibilities

  • Modify adhesives with trigger chemicals and study hysteresis heating responses under external stimuli.
  • Fabricate hybrid joints with modified adhesives and evaluate debonding behaviour.
  • Design and execute comprehensive test matrices for parametric studies.
  • Develop instrumentation and fixtures to automate testing procedures.
  • Apply advanced finite element analysis or machine‑learning tools for process optimisation.
  • Publish research findings in journals, present at conferences, and pursue patent opportunities.

Required profile

  • MSc, MTech or MEng in Materials Science, Mechanical, Chemical or Aerospace Engineering.
  • Background in polymer chemistry, adhesive‑bonded joint failure analysis, material or mechanical design, and rheology testing.
  • One to two years of academic or industrial research experience preferred.
  • Strong team player with project‑management abilities and a positive attitude.

Required skills

  • Hands‑on experience handling polymers and adhesive bonding technology.
  • Design of machines or mechanisms and execution of mechanical testing.
  • Proficiency with finite element analysis tools.
  • Knowledge of machine‑learning techniques for material process optimisation.

Questions fréquentes

Le salaire n'est pas communiqué publiquement par le recruteur. Vous pouvez postuler et négocier directement avec NTU.
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Source : ats:workday

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Published 3 days ago

Expires 1 month from now

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NTU

Singapore