Senior Thermal/Hardware Engineer

About the role

Hewlett Packard Enterprise is hiring a Senior Thermal/Hardware Engineer in Singapore, an onsite role based primarily in an HPE office. The engineer designs, analyzes and validates thermal systems, electronics packaging, heatsinks and enclosures for high-density, high-power networking platforms, and leads thermal design and validation from concept through mass production.

Key responsibilities

• Lead system-level thermal design, simulation and validation for high-density, high-power networking platforms, owning the full lifecycle from heatsink design and CFD simulation to in-lab testing and data analysis.
• Design and validate thermal solutions for electronics enclosures, chassis and line cards, and define thermal validation test plans covering thermal margin, acoustics, shock/vibration, reliability and safety.
• Drive system-level design tradeoffs with mechanical, electrical, power, firmware and software teams, and represent the thermal team across large development programs.
• Manage manufacturing partners, suppliers and external partners, lead root-cause analysis and corrective actions, and mentor junior engineers.

Required profile

• Bachelor's or Master's degree in Mechanical Engineering or a related field.
• 10+ years of experience in thermal design and electronics packaging, with a track record leading thermal development on networking platforms.
• Proven technical leadership, clear communication with peers and senior leadership, and ability to drive design innovation.

Required skills

• Deep expertise in thermal design and electronics packaging for data center and networking systems.
• Proficiency in CFD tools such as FloTHERM, with correlation of simulations to lab measurements.
• Hands-on experience with thermocouples, DAQs, environmental chambers and airflow/pressure benches, plus test automation scripts in Python.
• Design of heatsinks, sheet metal, plastic parts, ducts and baffles, and design-for-manufacture with vendors and contract manufacturers.